9月25日消息 据台媒报道，AMD首席执行官苏姿丰和公司其他C级高管计划于9月底至11月初前往台湾地区，打算会见台积电、芯片封装专家和大型PC制造商。
苏姿丰计划与台积电首席执行官魏哲家讨论未来的合作。台媒援引知情人士的消息称，讨论的主题包括台积电的“N3 Plus”制造节点（可能是N3P）和N2（2nm级）制造技术的使用。此外，两家公司的首席执行官将讨论未来订单的计划，其中包括可用或将在短期内可用的技术。
据了解，台积电计划在2025年下半年的某个时候开始在N2节点上量产芯片，因此AMD是时候开始谈论在其2026年及以后的产品中使用N2的细节了。
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